SIP-98

Copper infiltration is the process of filling pores of a sintered or unsintered PM compacts with a metal or alloy of a lower melting point than the base metal. The infiltration process will produce parts with greater density, increased strength, toughness, hardness and thermal and electrical conductivity.
SIP-98 is a low residue powder with better than 98% efficiency. The best performance, especially higher strength of parts, can be achieved in dissociated ammonia or low dew point nitrogen-based atmospheres.

SIP-97S

Copper infiltration is the process of filling pores of a sintered or unsintered PM compacts with a metal or alloy of a lower melting point than the base metal. The infiltration process will produce parts with greater density, increased strength, toughness, hardness and thermal and electrical conductivity.
SIP-97S is a low residue powder with better than 97% efficiency. Its residue is very loose and easy to be removed. The smooth surface of parts can be obtained after infiltrated.